MB300 Electronic Grade Polishing Resins

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Item # Item Name Functional Groups Volume Ratio Total Exchange Capacity Water Retention Capacity
H + Form MB300, 45 to 50 Percent (%) Water Retention Capacity Electronic Grade Polishing Resin Sulfonic Acid 50 % 1.8 eq/l min 45 to 50 %
OH - Form MB300, 53 to 60 Percent (%) Water Retention Capacity Electronic Grade Polishing Resin Quaternary Amine 50 % 1 eq/l min 53 to 60 %