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Product Line Description
MB400, 45 to 50 Percent (%) Water Retention Capacity Electronic Grade Polishing Resin
| Specifications | |
|---|---|
| Brands | HUAMO JMCC |
| Typical Physical and Chemical Properties | |
| Polymer Matrix Structure | Gel Polystyrene Crosslinked with Divinylbenzene (DVB) |
| Functional Groups | Sulfonic Acid |
| Volume Ratio | 40 % |
| Total Exchange Capacity | 1.8 eq/l min |
| Water Retention Capacity | 45 to 50 % |
| Particle Size Distribution | 0.40 to 1.25 mm |
| Maximum Percentage (%) for > 1.25 Millimeter (mm) Particle Size | 5 % |
| Maximum Percentage (%) for < 0.40 Millimeter (mm) Particle Size | 2 % |
| Maximum Percentage (%) for Whole Bead Count | 95 % |
| Maximum Percentage (%) for Moisture Content (As Shipped) | 65 % |
| Potential of Hydrogen (pH) Stability Range | 0 to 14 pH |
| Approximate Shipping Weight | 0.67 to 0.77 g/L |
| Minimum Ionic Conversion | 95 % |