H + Form

Product Line Description

MB400, 45 to 50 Percent (%) Water Retention Capacity Electronic Grade Polishing Resin

Specifications
Brands HUAMO
JMCC
Typical Physical and Chemical Properties
Polymer Matrix Structure Gel Polystyrene Crosslinked with Divinylbenzene (DVB)
Functional Groups Sulfonic Acid
Volume Ratio 40 %
Total Exchange Capacity 1.8 eq/l min
Water Retention Capacity 45 to 50 %
Particle Size Distribution 0.40 to 1.25 mm
Maximum Percentage (%) for > 1.25 Millimeter (mm) Particle Size 5 %
Maximum Percentage (%) for < 0.40 Millimeter (mm) Particle Size 2 %
Maximum Percentage (%) for Whole Bead Count 95 %
Maximum Percentage (%) for Moisture Content (As Shipped) 65 %
Potential of Hydrogen (pH) Stability Range 0 to 14 pH
Approximate Shipping Weight 0.67 to 0.77 g/L
Minimum Ionic Conversion 95 %